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Experience with vapor phase soldering device

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F10%3A00189629" target="_blank" >RIV/68407700:21220/10:00189629 - isvavai.cz</a>

  • Result on the web

    <a href="http://www.strojarstvo.sk/strext/09_Do_akol.pdf" target="_blank" >http://www.strojarstvo.sk/strext/09_Do_akol.pdf</a>

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Experience with vapor phase soldering device

  • Original language description

    A system using resistive heaters is described. Temperature of soldering liquid increases to boiling point temperature and keeps liquid temperature at boiling temperature a few seconds. The melted solder paste joined electronic elements with printed circuit board lands. The system uses cold liquid with hot liquid mixing to cool down. The melted solder paste condensed to create soldering joint.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2010

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Strojárstvo

  • ISSN

    1335-2938

  • e-ISSN

  • Volume of the periodical

  • Issue of the periodical within the volume

    5

  • Country of publishing house

    SK - SLOVAKIA

  • Number of pages

    4

  • Pages from-to

    1-4

  • UT code for WoS article

  • EID of the result in the Scopus database