Experience with vapor phase soldering device
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F10%3A00189629" target="_blank" >RIV/68407700:21220/10:00189629 - isvavai.cz</a>
Result on the web
<a href="http://www.strojarstvo.sk/strext/09_Do_akol.pdf" target="_blank" >http://www.strojarstvo.sk/strext/09_Do_akol.pdf</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Experience with vapor phase soldering device
Original language description
A system using resistive heaters is described. Temperature of soldering liquid increases to boiling point temperature and keeps liquid temperature at boiling temperature a few seconds. The melted solder paste joined electronic elements with printed circuit board lands. The system uses cold liquid with hot liquid mixing to cool down. The melted solder paste condensed to create soldering joint.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Strojárstvo
ISSN
1335-2938
e-ISSN
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Volume of the periodical
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Issue of the periodical within the volume
5
Country of publishing house
SK - SLOVAKIA
Number of pages
4
Pages from-to
1-4
UT code for WoS article
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EID of the result in the Scopus database
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