Experience with Vapor Phase Soldering Device
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F10%3A00167129" target="_blank" >RIV/68407700:21220/10:00167129 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Experience with Vapor Phase Soldering Device
Original language description
A system using resistive heaters is described. Temperature of soldering liquid increases to boiling point temperature and keeps liquid temperature at boiling temperature a few seconds. The melted solder paste joined electronic elements with printed circuit board lands. The system uses cold liquid with hot liquid mixing to cool down. The melted solder paste condensed to create soldering joint
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
ARTEP - Zborník príspevkov
ISBN
978-80-553-0347-5
ISSN
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e-ISSN
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Number of pages
9
Pages from-to
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Publisher name
Technical University of Košice
Place of publication
Košice
Event location
Stará Lesná
Event date
Feb 24, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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