VAPOR PHASE SOLDERING DEVICE
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F10%3A00168420" target="_blank" >RIV/68407700:21220/10:00168420 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
VAPOR PHASE SOLDERING DEVICE
Original language description
A system using resistive heaters is described. Temperature of soldering liquid increases to boiling point temperature and keeps liquid temperature at boiling temperature a few seconds. The melted solder paste joined electronic elements with printed circuit board lands. The system uses cold liquid with hot liquid mixing to cool down. The melted solder paste condensed to create soldering
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of The 9th International Conference Process Control 2010
ISBN
978-80-7399-951-3
ISSN
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e-ISSN
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Number of pages
9
Pages from-to
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Publisher name
Universita Pardubice
Place of publication
Pardubice
Event location
Kouty nad Desnou
Event date
Jun 7, 2010
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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