Study of the microstructure of UFG copper in UHV SLEEM
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F09%3APU80063" target="_blank" >RIV/00216305:26210/09:PU80063 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Study of the microstructure of UFG copper in UHV SLEEM
Original language description
The objective of the present work was to study the stability of microstructure of ultra fine-grained (UFG) copper under high-cycle and very high-cycle fatigue loading and under thermal exposition. UFG Cu was prepared by equal channel angular pressing. Nograin coarsening was observed after fatigue resulting in failure in the interval from 104 to 1010 cycles. Similarly, no grain coarsening was detected after thermal exposition at a temperature of 180 C for 6 min. The microstructure was examined by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM).
Czech name
Studium mikrostruktury ultrajemnozrnné Cu v UHV SLEEM
Czech description
Příspěvek se zabývá stabilitou mikrostruktury ultra jemnozrnné Cu v oblasti vysokocyklové a gigacyklové únavy a teplotní mikrostrukturní stabilitou.
Classification
Type
O - Miscellaneous
CEP classification
JG - Metallurgy, metal materials
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů