Mechanical properties of Al thin film measured by microcompression

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F11%3APU95284" target="_blank" >RIV/00216305:26210/11:PU95284 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Mechanical properties of Al thin film measured by microcompression

Original language description

Two modern experimental techniques, the focused ion beam milling and the nanoindentation, were applied in order to measure exactly plastic properties of a Al-1.5%Cu thin film prepared by the physical vapour deposition, used for electrical connection of integrated circuits. By focused ion beam milling, cylindrical specimens were prepared. The height of the specimens was equal to the film thickness (2 micrometers) and their diameter was about 1.3 micrometers. These specimens were subjected to the compressive loading using the nanoindenter equipped by a flat punch. It is possible to obtain stress-strain curves of the thin film rather precisely.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JR - Other machinery industry

OECD FORD branch

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Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2011

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Applied mechanics 2011

ISBN

978-80-87434-03-1

ISSN

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e-ISSN

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Number of pages

4

Pages from-to

123-126

Publisher name

Neuveden

Place of publication

Neuveden

Event location

Velké Bílovice

Event date

Apr 18, 2011

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

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