Mechanical properties of Al thin films measured by microcompression

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F11%3A00369042" target="_blank" >RIV/68081723:_____/11:00369042 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Mechanical properties of Al thin films measured by microcompression
Original language description
Two modern experimental techniques, the focused ion beam milling and the nanoindentation, were applied in order to measure exactly plastic properties of a Al-1.5%Cu thin film prepared by the physical vapour deposition, used for electrical connection of integrated circuits. By focused ion beam milling, cylindrical specimens were prepared. The height of the specimens was equal to the film thickness (2 micrometers) and their diameter was about 1.3 micrometers. These specimens were subjected to the compressive loading using the nanoindenter equipped by a flat punch. It is possible to obtain stress-strain curves of the thin film rather precisely.
Czech name
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Czech description
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Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Applied Mechanics 2011
ISBN
978-80-87434-03-1
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
123-126
Publisher name
Institute of Physics of Materials, Academy of Sciences of the Czech Republic
Place of publication
Brno, Česká republika
Event location
Velké Bílovice
Event date
Apr 18, 2011
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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