Modelling of 3D Multimodule Substrate
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU37823" target="_blank" >RIV/00216305:26220/03:PU37823 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Modelling of 3D Multimodule Substrate
Original language description
Electronic assembly tries to reach low cost and very fast design-to-production process. The stacked packages are one of possible ways of solution. This article focuses on thermomechanical modelling of two materials with different CTE, which are commonlyused in today's electronic devices - FR4 and ceramic material 96%Al2O3. These substrates are connected with lead free solder SnAgCu. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of therrmomechanical properties of MSMs when solder bumps changed diameter.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of 27-th International Conference and Exhibition IMAPS-Poland 2003
ISBN
83-917701-0-9
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
126-129
Publisher name
International Microelectronics and Packaging Society Poland-Chapter
Place of publication
Gliwice, Poland
Event location
Ostaniec Hotel, Podlesice, Gliwice, Poland
Event date
Sep 16, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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