Some New Results from Investigation of Lead-free Solders Application

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F04%3APU45693" target="_blank" >RIV/00216305:26220/04:PU45693 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Some New Results from Investigation of Lead-free Solders Application

Original language description

This paper deals with some aspects of solder joint quality in context with introduction of Pb-free solder compounds in EU legislation. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE ? Waste Electrical and Electronic Equipmentand RoHS ? Restriction of use of certain Hazardous Substances). The date 1st of July 2006 is nearer and there isn?t clear, which of Pb-free systems will definitively replace SnPb materials with correspondent success. Many factors have to be valuated inthis context and that needs some knowledge about materials and process compatibility in different industrial conditions. One of the most important is wettability and spreadability, which is closed to many factors. Material select.,ion for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy compo

Czech name

Nové poznatky z aplikací bezolovnatých pájek

Czech description

Přednáška řeší některé aspekty kvality pájeného spoje v kontextu s novou legislativou EU. Bezolovnaté pájení je v souladu s normami ECO a WEEE ? Waste Electrical and Electronic Equipment and RoHS ? Restriction of use of certain Hazardous Substances). Nejzazší termin přechodu na bezolovnaté pájení je 1.7.2006.

Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

<a href="/en/project/GA102%2F04%2F0590" target="_blank" >GA102/04/0590: Development of microelectronics technologies for 3D circuits and systems</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2004

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Proceedings of IMAPS Nordic 2004 Annual Conference

ISBN

951-98002-6-3

ISSN

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e-ISSN

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Number of pages

7

Pages from-to

49-55

Publisher name

IMAPS Nordic

Place of publication

Helsingor, Denmark

Event location

Helsingor

Event date

Sep 26, 2004

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

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