Wettability ? SnPb and Lead-free

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F04%3APU44041" target="_blank" >RIV/00216305:26220/04:PU44041 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Wettability ? SnPb and Lead-free
Original language description
Lead free soldering implementation process needs some knowledge?s about behavior of lead-free materials where fundamental seems to be wettability. Without good wettability the process performance can?t be convenient technical and economical too. Materialselection for soldering process has to be compatible for having the best results in wetting characteristics, which are important for solder joint formation, and for final solder joint reliability. This includes optimal selection of fluxes, air/nitrogenatmosphere, solders alloy compositions, surface treatments of components and PCBs and other factors. This paper presents some facts from this area.
Czech name
Smáčivost pro olovnaté a bezolovnaté pájky
Czech description
U bezolovnatých pájek došlo ke změně některých parametrů, mezi něž patří i smáčivost. Tento článek se zabývá problematikou měření smáčivosti a expirementy.

Project
<a href="/en/project/GA102%2F04%2F0590" target="_blank" >GA102/04/0590: Development of microelectronics technologies for 3D circuits and systems</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2004
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
11th Electronic Devices and Systems Conference 2004 Proceedings
ISBN
80-214-2701-9
ISSN
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e-ISSN
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Number of pages
411
Pages from-to
407-817
Publisher name
Ing. Zdeněk Novotný CSc.,Brno
Place of publication
Brno
Event location
Brno
Event date
Sep 9, 2004
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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