Influence of Bump Height to Multisubstrate Structures Construction
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU37824" target="_blank" >RIV/00216305:26220/03:PU37824 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Influence of Bump Height to Multisubstrate Structures Construction
Original language description
This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changedd.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of 10-th Electronic Devices and Systems Conference 2003
ISBN
80-214-2452-4
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
377-381
Publisher name
Ing. Zdeněk Novotný CSc., Brno
Place of publication
Brno
Event location
Brno
Event date
Sep 9, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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