Modelling of 3D Multisubstrate Structures

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU38468" target="_blank" >RIV/00216305:26220/03:PU38468 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Modelling of 3D Multisubstrate Structures

Original language description

This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changedd.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2003

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

ElectronicsLetters.com - http://www.electronicsletters.com

ISSN

1213-161X

e-ISSN

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Volume of the periodical

2003

Issue of the periodical within the volume

4/11

Country of publishing house

CZ - CZECH REPUBLIC

Number of pages

1

Pages from-to

1-1

UT code for WoS article

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EID of the result in the Scopus database

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