Solder Joint Quality
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU37826" target="_blank" >RIV/00216305:26220/03:PU37826 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Solder Joint Quality
Original language description
A physical limit to increasing current density or to decreasing integrated circuit dimension in both microelectronics and power electronics is the performance of solder joint connections and their reliability. It is connected with effect of electromigration and following intermetallic layer growth. Electromigration of solder joint is the major failure phenomenon in integrated circuits, but until recently it was seldom recognized as a reliability concern for solder joints. Actual very significant need off industry is to assure solder production process to produce reliable solder joints. For this it is necessary to understand basic approach to solder joint existence.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of 10-th Electronic Devices and Systems Conference 2003
ISBN
80-214-2452-4
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
388-393
Publisher name
Ing. Zdeněk Novotný, CSc., Brno
Place of publication
Brno
Event location
Brno
Event date
Sep 9, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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