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Current density distribution, noise and non-linearity of thick film resistors

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU39160" target="_blank" >RIV/00216305:26220/03:PU39160 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Current density distribution, noise and non-linearity of thick film resistors

  • Original language description

    The noise spectroscopy and third harmonic measurements were used to investigate effect of the contact electrode material on the thick film resistor quality and reliability. Strong dependence of non-linearity both on the type of the resistor paste and contract electrode material was observed. Dependence of noise quality indicator on the type of resistor paste is important, the influence of contact electrode material was studied using standard statistical evaluation. Thick film resistors with AgPd contacct electrode have higher value of third harmonic voltage, but show better long term stability and reliability comparing with resistors with Ag contact electrode. From the SEM figures we determined, that the sharpness of AgPd contact electrode is approximately half of Ag contact electrode. It was proved experimentally that noise spectral density is proportional to electric field intensity, while third harmonic voltage depends on the third power of electric field intensity or current densit

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

    <a href="/en/project/ME%20605" target="_blank" >ME 605: Noise of HEMT for global communication</a><br>

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2003

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Proceedings of 14th European Microelectronics and Packaging Conference

  • ISBN

  • ISSN

  • e-ISSN

  • Number of pages

    6

  • Pages from-to

    127-132

  • Publisher name

    IMAPS Germany

  • Place of publication

    Německo

  • Event location

    Friedrichshafen

  • Event date

    Jun 23, 2003

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article