Current density distribution, noise and non-linearity of thick film resistors
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU39160" target="_blank" >RIV/00216305:26220/03:PU39160 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Current density distribution, noise and non-linearity of thick film resistors
Original language description
The noise spectroscopy and third harmonic measurements were used to investigate effect of the contact electrode material on the thick film resistor quality and reliability. Strong dependence of non-linearity both on the type of the resistor paste and contract electrode material was observed. Dependence of noise quality indicator on the type of resistor paste is important, the influence of contact electrode material was studied using standard statistical evaluation. Thick film resistors with AgPd contacct electrode have higher value of third harmonic voltage, but show better long term stability and reliability comparing with resistors with Ag contact electrode. From the SEM figures we determined, that the sharpness of AgPd contact electrode is approximately half of Ag contact electrode. It was proved experimentally that noise spectral density is proportional to electric field intensity, while third harmonic voltage depends on the third power of electric field intensity or current densit
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/ME%20605" target="_blank" >ME 605: Noise of HEMT for global communication</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of 14th European Microelectronics and Packaging Conference
ISBN
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ISSN
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e-ISSN
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Number of pages
6
Pages from-to
127-132
Publisher name
IMAPS Germany
Place of publication
Německo
Event location
Friedrichshafen
Event date
Jun 23, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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