Analysis of silver diffusion into thick film resistor layers

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F04%3APU44703" target="_blank" >RIV/00216305:26220/04:PU44703 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Analysis of silver diffusion into thick film resistor layers

Original language description

A silver diffusion and migration from contact electrode into thick film resistive layer and its influence on resistor characteristics was analysed. Strong dependence of non-linearity and noise on the contact electrode material was observed. Thick film resistors with AgPd contact electrode have higher value of third harmonic voltage, but show better long term stability and reliability comparing with resistors with Ag contact electrode. Silver diffusion results to the resistive layer conductivity increasee not only in the vicinity of contact, but in the thick film resistor also. This leads to the lowering of the electric field intensity near the contact and effective shortening of thick film resistor length. The scanning electron microscopy, noise spectroscopy and third harmonic measurements were used to investigate this effect. Numerical model was performed to estimate the influence of silver diffusion and migration on resistance changes due to firing and ageing. The model shows that th

Czech name

Analýza difuze stříbra do tlustovrstvových odporů

Czech description

A silver diffusion and migration from contact electrode into thick film resistive layer and its influence on resistor characteristics was analysed. Strong dependence of non-linearity and noise on the contact electrode material was observed. Thick film resistors with AgPd contact electrode have higher value of third harmonic voltage, but show better long term stability and reliability comparing with resistors with Ag contact electrode. Silver diffusion results to the resistive layer conductivity increasee not only in the vicinity of contact, but in the thick film resistor also. This leads to the lowering of the electric field intensity near the contact and effective shortening of thick film resistor length. The scanning electron microscopy, noise spectroscopy and third harmonic measurements were used to investigate this effect. Numerical model was performed to estimate the influence of silver diffusion and migration on resistance changes due to firing and ageing. The model shows that th

Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

<a href="/en/project/ME%20605" target="_blank" >ME 605: Noise of HEMT for global communication</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2004

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Proceedings of 3rd European Microelectronics and Packaging Symposium with Table-Top Exhibition

ISBN

80-239-2835-X

ISSN

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e-ISSN

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Number of pages

665

Pages from-to

660-1324

Publisher name

IMAPS CZ&SK Chapter

Place of publication

Lanskroun

Event location

Prague

Event date

Jun 16, 2004

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

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