The effect of silver diffusion from contact electrode into thick film resistors
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU39179" target="_blank" >RIV/00216305:26220/03:PU39179 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
The effect of silver diffusion from contact electrode into thick film resistors
Original language description
We investigate the effect of silver diffusion and migration from contact electrode into thick film resistive layer and its influence on resistor stability. Silver diffusion results to the resistive layer conductivity increase in the vicinity of contact.This leads to effective shortening of thick film resistor length and lowering of the electric field intensity near the contact. The noise spectroscopy and third harmonic measurements were used to investigate this effect. Numerical model of current densitty and electric field distribution was performed to estimate the influence of silver diffusion and migration.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/ME%20605" target="_blank" >ME 605: Noise of HEMT for global communication</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
CARTS - EUROPE 2003 Proceedings
ISBN
0887-7491
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
201-204
Publisher name
Electronic Components Institute Internationale Ltd.
Place of publication
United Kingdom
Event location
Stuttgart
Event date
Oct 27, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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