Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU39345" target="_blank" >RIV/00216305:26220/03:PU39345 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate
Original language description
This study explores the thermomechanical stresses of solder joint and solder joint fatigue life predictions calculated by finite elemement software ANSYS
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Electronic Devices and Systems 2003 - Proceedins
ISBN
80-214-2452-4
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
394-397
Publisher name
Brno University of Technology
Place of publication
Brno University of Technology
Event location
Brno
Event date
Sep 9, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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