New Facts from Lead-free Solders Reliability Investigation
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F10%3APU89922" target="_blank" >RIV/00216305:26220/10:PU89922 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
New Facts from Lead-free Solders Reliability Investigation
Original language description
The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/GA102%2F09%2F1701" target="_blank" >GA102/09/1701: Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Electronics System Integration Technology Conference ESTC 2010 in Berlin
ISBN
978-1-4244-8555-0
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
Neuveden
Place of publication
Berlín, Německo
Event location
Berlin
Event date
Sep 13, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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