ANALYSIS AND PREDICTION OF RELIABILITY OF SOLDER JOINTS
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3APU114874" target="_blank" >RIV/00216305:26220/15:PU114874 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
ANALYSIS AND PREDICTION OF RELIABILITY OF SOLDER JOINTS
Original language description
This arcticle deals with the sphere of solder joints reliability and narrower focus is using simulation software ANSYS and fatigue models for estimate reliability of solder joints. The text describes the introduction to the issue of the reliability of soldered connections and important factors with their influences. Then are described some options for prediction of reliability. This includes the issue of fatigue models and design of simulation in simulating software ANSYS. In conclusion, there are described outputs of simulations and options for calculation by fatigue models.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 21st Conference STUDENT EEICT 2015
ISBN
978-80-214-5148-3
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
381-385
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Place of publication
Brno
Event location
Brno
Event date
Apr 23, 2015
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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