RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3APU116822" target="_blank" >RIV/00216305:26220/15:PU116822 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

Original language description

This article deals with the area of solder joints reliability and narrower focus is on interconnetion between FR-4 and low temperature co-fired substrate LTCC via smd part. The text describes the introduction to the issue of reliability of soldered connections and important factors with their influences. These factors also relate with choice of substrates and technological processes of preparation, which are characterized and described. Another part is devoted to the sphere of computer analysis in ANSYSand the specifically. Then are included some options for analysis of reliability. It contains the issue of fatigue models and design of simulation in ANSYS. In conclusion, there are described otuputs of simulations and results obtained from experimentalmeasurements and these are compared and analyzed.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2015

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Nanocon 2015 Conference proceedings

ISBN

978-80-87294-59-8

ISSN

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e-ISSN

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Number of pages

9

Pages from-to

1-1

Publisher name

Tanger, Ltd.

Place of publication

Ostrava

Event location

Brno

Event date

Oct 15, 2015

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

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