The Mechanical Strength of Solder Joints on PCB with OSP surface protection
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU119173" target="_blank" >RIV/00216305:26220/16:PU119173 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org.ezproxy.lib.vutbr.cz/document/7563199/authors" target="_blank" >http://ieeexplore.ieee.org.ezproxy.lib.vutbr.cz/document/7563199/authors</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2016.7563199" target="_blank" >10.1109/ISSE.2016.7563199</a>
Alternative languages
Result language
angličtina
Original language name
The Mechanical Strength of Solder Joints on PCB with OSP surface protection
Original language description
This paper describes some results obtained by the study of influences of different factors which define reliability of solder joints. Generally, these factors include substrate, type of solder paste, soldered components, surface protection of soldering areas and methods of reflowing. In our case, these influences are evaluated with focus on PCB with OSP surface protection under condition of thermal cycling and shear testing. The results from experimental measuring are complemented with computer analysis of models of solder joints and components in ANSYS. Finally, there is evaluation of practical results in conjunction with simulations.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016
ISBN
978-1-5090-1389-0
ISSN
2161-2536
e-ISSN
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Number of pages
5
Pages from-to
249-253
Publisher name
IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Place of publication
Pilsen, Czech republic
Event location
Pilsen, Czech Republic
Event date
May 18, 2016
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
000387089800050