An evaluation of components offset and solder spreadability using factorial experiments

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00315614" target="_blank" >RIV/68407700:21230/17:00315614 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/document/8000955/" target="_blank" >http://ieeexplore.ieee.org/document/8000955/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2017.8000955" target="_blank" >10.1109/ISSE.2017.8000955</a>

Result language
angličtina
Original language name
An evaluation of components offset and solder spreadability using factorial experiments
Original language description
This article presents a comparison of various modifications of surfaces of components and the methods of soldering and their influences on the lead-free solders [1]. The parameters studied were the spreadability of solder and offset components. These properties depend not only on the type of solder but also on the modifying of the surface of components. To evaluate a series of samples we used 3D microscope HAWK QC 5000 NIS Elements BR. The method for analyses of factor effects was chosen the statistical method of Developing of Experiments (DOE) [2]. This work would help to facilitate the selection of suitable material combinations for achieving the highest quality solder joint
Czech name
—
Czech description
—

Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
40th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-5386-0582-0
ISSN
2161-2536
e-ISSN
—
Number of pages
4
Pages from-to
—
Publisher name
IEEE
Place of publication
New York
Event location
Sofia
Event date
May 10, 2017
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000426973000078

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