Optimizing of Solder Joint Reliability by 3D Modeling
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F04%3APU43642" target="_blank" >RIV/00216305:26220/04:PU43642 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Optimizing of Solder Joint Reliability by 3D Modeling
Original language description
This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today?s electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical prooperties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading.
Czech name
Optimalizace spolehlivosti pajenych spoju pomoci 3D modelovani
Czech description
Příspěvek je zaměřen na termomechaniké modelování dvou substrátů s různým CTE. Jedním z materiálů je laminát FR4, druhým je keramika 96% Al2O3. Spojení substrátů je zajištěno pomocí spojů realizovaných bezolovnatou pájkou SnAgCu. Cílem je popsat vliv rozměrů a tvaru pájených spojů na mechanické napětí v struktuře vznikající.
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/GA102%2F04%2F0590" target="_blank" >GA102/04/0590: Development of microelectronics technologies for 3D circuits and systems</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2004
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of 3rd Microelectronics and Packaging Symposium with Table Top Exhibition
ISBN
80-239-2835-X
ISSN
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e-ISSN
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Number of pages
200
Pages from-to
195-394
Publisher name
IMAPS CZ&SK Chapter
Place of publication
Lanskroun
Event location
Prague
Event date
Jun 16, 2004
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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