Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F11%3APU90508" target="_blank" >RIV/00216305:26220/11:PU90508 - isvavai.cz</a>

Result on the web

<a href="http://www.scientific.net/KEM.465.491" target="_blank" >http://www.scientific.net/KEM.465.491</a>

DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Reliability and Simulation of Lead-Free Solder Joint Behavior in 3D Packaging Structure

Original language description

This paper deals with behavior of lead-free solder joint applied in 3D electronic packaging structure. There are plenty of factors which influences reliability and life-time of solder compound connection. Type of substrates, selection of materials and process arrangement are the main areas to investigate. The content consists from three main parts. The first deals with introduction of designed test pattern, material, and process arrangement and applied testing methods. Second part continues with ANSYS software simulation of solder interconnections during thermo-mechanical stress tests and third part is aimed to experimental evaluation of results in the comparison to simulated results.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2011

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Key Engineering Materials Vol. 465 (2011)

ISBN

978-3-03785-006-0

ISSN

1013-9826

e-ISSN

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Number of pages

4

Pages from-to

491-494

Publisher name

Trans Tech Publications

Place of publication

Švýcarsko

Event location

Brno

Event date

Jun 28, 2010

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

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