Designing of infrared heater with homogenous heat transfer

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU120524" target="_blank" >RIV/00216305:26220/16:PU120524 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org.ezproxy.lib.vutbr.cz/stamp/stamp.jsp?arnumber=7563162" target="_blank" >http://ieeexplore.ieee.org.ezproxy.lib.vutbr.cz/stamp/stamp.jsp?arnumber=7563162</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2016.7563162" target="_blank" >10.1109/ISSE.2016.7563162</a>

Result language
angličtina
Original language name
Designing of infrared heater with homogenous heat transfer
Original language description
This paper deal with the description of possibilities in designing of infrared heaters for reflow soldering. Main work was divided into two parts, simulation and realization. Simulation helps find the best solution of IR heater arrangement. The research was focused on the homogeneity of transferred heat to soldered component. In realization part, there was manufactured a prototype of IR heater in the best solution.
Czech name
—
Czech description
—

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016
ISBN
978-1-5090-1389-0
ISSN
2161-2536
e-ISSN
—
Number of pages
534
Pages from-to
62-65
Publisher name
IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Place of publication
Pilsen, Czech Republic
Event location
Pilsen, Czech Republic
Event date
May 18, 2016
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
000387089800013

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