Contamination of PCB after the soldering process with ?NO-clean? solder pastes
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F13%3A43919730" target="_blank" >RIV/49777513:23220/13:43919730 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
čeština
Original language name
Kontaminace DPS po pájecím procesu s "NO-Clean" pájecími pastami
Original language description
This paper deals with contamination of PCB after soldering process. First part presents the ionic contamination and the experiment. For measuring of contamination the contaminometer CM11 was chosen. Three No-clean solder pastes were used for testing. Thetested samples were made of PCB where the solder pastes were applied. The tested samples were soldered with different solder profiles. After the soldering process ionic contamination was measured and evaluated. The obtained results were discussed.
Czech name
Kontaminace DPS po pájecím procesu s "NO-Clean" pájecími pastami
Czech description
This paper deals with contamination of PCB after soldering process. First part presents the ionic contamination and the experiment. For measuring of contamination the contaminometer CM11 was chosen. Three No-clean solder pastes were used for testing. Thetested samples were made of PCB where the solder pastes were applied. The tested samples were soldered with different solder profiles. After the soldering process ionic contamination was measured and evaluated. The obtained results were discussed.
Classification
Type
O - Miscellaneous
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů