Impact of no-clean fluxes cleaning on PCB Ionic contamination
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925341" target="_blank" >RIV/49777513:23220/15:43925341 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247989&newsearch=true&queryText=Impact%20of%20no-clean%20fluxes%20cleaning%20on%20PCB%20Ionic%20contamination" target="_blank" >http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247989&newsearch=true&queryText=Impact%20of%20no-clean%20fluxes%20cleaning%20on%20PCB%20Ionic%20contamination</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2015.7247989" target="_blank" >10.1109/ISSE.2015.7247989</a>
Alternative languages
Result language
angličtina
Original language name
Impact of no-clean fluxes cleaning on PCB Ionic contamination
Original language description
The paper describes the dependence of the ionic contamination of PCB after the soldering process with no-clean solder pastes on the type of cleaning. For the experiment three different types of solder paste were selected. Solder pastes were labeled as no-clean. The samples were reflowed with two different soldered profiles. The ionic contamination after soldering process was measured. Contamination of PCB was investigated to set up of solder profile. Then three different types of rinses were applied tothe samples. The rinsing medium was deionized water, 50% deionized water with 50% isopropyl alcohol (IPA) and IPA. The cleaning process was set to 10 minutes in an ultrasonic cleaning bath. Then rate of ionic contamination after application of cleaning the PCB were monitored. From the results there were determined by a recommendation on whether it is necessary to clean no-clean solder paste.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regional Innovation Centre for Electrical Engineering (RICE)</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 2015 38th International Spring Seminar on Electronics Technology (ISSE 2015)
ISBN
978-1-4799-8860-0
ISSN
2161-2528
e-ISSN
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Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscataway
Event location
Eger, Maďarsko
Event date
May 6, 2015
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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