Optimization of soldering process to reduce contamination and related consequences

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F18%3A43951566" target="_blank" >RIV/49777513:23220/18:43951566 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8443691" target="_blank" >https://ieeexplore.ieee.org/document/8443691</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2018.8443691" target="_blank" >10.1109/ISSE.2018.8443691</a>

Result language
angličtina
Original language name
Optimization of soldering process to reduce contamination and related consequences
Original language description
This paper deals with soldering profile optimization and with its impacts on the quality of the soldered joint. Properly adjusted soldering profile directly affects the PCB contamination level by flux residues. The experimental part of this article is focused on reducing the amount of ionic contamination on the PCB by means of a suitable setting of the soldering process. The profiles have been set according to the manufacturer's recommendations. The optimization of the soldering profile has been assessed with regard to the ionic contamination of PCB. Optimized soldering profile, however, affects other solder joints parameters that have an immediate effect on reliability. The consequences of profile optimization is verified by the wetting angle measurement, the intermetallic compound thickness measurement and the amount of voids contained in the solder joint. The paper includes a discussion of the measured results and an overall impact assessment of the profile optimization.
Czech name
—
Czech description
—

Project
<a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2018 41st International Spring Seminar on Electronics Technology (ISSE 2018) : /proceedings/
ISBN
978-1-5386-5731-7
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE
Place of publication
Piscataway
Event location
Zlatibor, Serbia
Event date
May 16, 2018
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000449866600065

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