Correlation analysis of wettability, intermetallic compound formation and PCB contamination

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925365" target="_blank" >RIV/49777513:23220/15:43925365 - isvavai.cz</a>

Result on the web

<a href="http://dx.doi.org/10.1108/CW-10-2014-0047" target="_blank" >http://dx.doi.org/10.1108/CW-10-2014-0047</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/CW-10-2014-0047" target="_blank" >10.1108/CW-10-2014-0047</a>

Result language

angličtina

Original language name

Correlation analysis of wettability, intermetallic compound formation and PCB contamination

Original language description

The purpose of this paper is to verify how solder joint properties correlate with soldering profile set-up. These characteristics act against each other. All observed properties may significantly affect the quality and reliability of solder joints. The purpose is also to design recommendations for manufacturers of electronic assemblies.The samples for experiment were reflowed by using a laboratory reflow oven. A LEXT laser confocal microscope was used for wetting angle and intermetallic compound (IMC) thickness measurement. The ionic contamination was measured by using a contaminometer.The appropriate choice of soldering profile is very important for the reliability of electronic assemblies. The higher temperatures or longer preheating and soldering times improve the wetting angle. Likewise, there is also the activation of all the fluxes. The result is low contamination with printed circuit boards (PCBs). On the other hand, we must not forget that higher temperatures and longer solderi

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

<a href="/en/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regional Innovation Centre for Electrical Engineering (RICE)</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2015

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Circuit world

ISSN

0305-6120

e-ISSN

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Volume of the periodical

41

Issue of the periodical within the volume

2

Country of publishing house

GB - UNITED KINGDOM

Number of pages

6

Pages from-to

70-75

UT code for WoS article

000353302000004

EID of the result in the Scopus database

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