Environment-friendly LF Solder SAC 305 and Its Reliability

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F09%3APU80581" target="_blank" >RIV/00216305:26220/09:PU80581 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Environment-friendly LF Solder SAC 305 and Its Reliability

Original language description

The article discusses the factors affecting the reliability and the longevity of soldering joints. It introduces the first results of the practical testing of the impact both of varied surfacing methods and the different base material's thickness on thelongevity of soldering joints executed by the leadless solder SAC 305. The testing boards are periodically left open for the impact of the temperatures between 0 to +100, with the delay of 15 minutes at the maximum temperature. Before the test itself theboards were aged at increased temperature according to the standard of IPC-SM-785. The first gained experimental data - number of cycles before the failure - were evaluated with the help of Weibull distribution in a graphical form.

Czech name

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Czech description

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Type

O - Miscellaneous

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2009

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů