Environment-friendly LF Solder SAC 305 and Its Reliability

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F09%3APU80582" target="_blank" >RIV/00216305:26220/09:PU80582 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Environment-friendly LF Solder SAC 305 and Its Reliability
Original language description
The article discusses the factors affecting the reliability and the longevity of soldering joints. It introduces the first results of the practical testing of the impact both of varied surfacing methods and the different base material's thickness on thelongevity of soldering joints executed by the leadless solder SAC 305. The testing boards are periodically left open for the impact of the temperatures between 0 to +100, with the delay of 15 minutes at the maximum temperature. Before the test itself theboards were aged at increased temperature according to the standard of IPC-SM-785. The first gained experimental data - number of cycles before the failure - were evaluated with the help of Weibull distribution in a graphical form..
Czech name
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Czech description
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Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
ISSE 2009 32nd International Spring Seminar on Electronics Technology. 2009. Hetero System Integration, the path to New Solutions in the Modern Electronics. Abstracts Proceedings.
ISBN
978-1-4244-4260-7
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
Novpress s.r.o.
Place of publication
Brno
Event location
Brno
Event date
May 13, 2009
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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