Interface Resistance between Polymer Based Conducting and Resistive Layers
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F09%3APU81660" target="_blank" >RIV/00216305:26220/09:PU81660 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Interface Resistance between Polymer Based Conducting and Resistive Layers
Original language description
We have studied the interface resistance between the polymer based conducting and resistive thick film layers. The samples were made using different resistive pastes and dipping silvers. The composite of carbon and graphite (C/Gr) conducting particles suspended in different polymer vehicles were used for the thick film resistive layers preparation. Interface resistance RI created between the contact layer made from dipping silver (DiAg) and resistive layer was determined from the surface potential distribution measurements and its value was less than 1% of total sample resistance. Measuring apparatus DISPOT designed in our laboratory provides the measuring of a surface potential distribution. The measuring probe is sliding on the surface of measured structure and potential change between the successive steps is normalized by the total current flowing through the structure. Elementary step (the shortest distance between two measurements) is 1.25 m. The equipment is arranged for current
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
BE - Theoretical physics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/GD102%2F09%2FH074" target="_blank" >GD102/09/H074: Diagnostics of material defects using the latest defectoscopic methods</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
17th European Microelectronics and Packaging Conference & Exhibition
ISBN
978-1-4244-4722-0
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
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Publisher name
Neuveden
Place of publication
Italie
Event location
Rimini
Event date
Jun 15, 2009
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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