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Interface Resistance between Polymer Based Conducting and Resistive Layers

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F09%3APU81660" target="_blank" >RIV/00216305:26220/09:PU81660 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Interface Resistance between Polymer Based Conducting and Resistive Layers

  • Original language description

    We have studied the interface resistance between the polymer based conducting and resistive thick film layers. The samples were made using different resistive pastes and dipping silvers. The composite of carbon and graphite (C/Gr) conducting particles suspended in different polymer vehicles were used for the thick film resistive layers preparation. Interface resistance RI created between the contact layer made from dipping silver (DiAg) and resistive layer was determined from the surface potential distribution measurements and its value was less than 1% of total sample resistance. Measuring apparatus DISPOT designed in our laboratory provides the measuring of a surface potential distribution. The measuring probe is sliding on the surface of measured structure and potential change between the successive steps is normalized by the total current flowing through the structure. Elementary step (the shortest distance between two measurements) is 1.25 m. The equipment is arranged for current

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    BE - Theoretical physics

  • OECD FORD branch

Result continuities

  • Project

    <a href="/en/project/GD102%2F09%2FH074" target="_blank" >GD102/09/H074: Diagnostics of material defects using the latest defectoscopic methods</a><br>

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2009

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    17th European Microelectronics and Packaging Conference & Exhibition

  • ISBN

    978-1-4244-4722-0

  • ISSN

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

  • Publisher name

    Neuveden

  • Place of publication

    Italie

  • Event location

    Rimini

  • Event date

    Jun 15, 2009

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article