The Contact Resistance at Interface of Two Different Thick Film Layers
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F08%3A00147332" target="_blank" >RIV/68407700:21230/08:00147332 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
The Contact Resistance at Interface of Two Different Thick Film Layers
Original language description
The work is focused on analysis of interface of two different thick film layers. Contact resistance between conductive a resistive layers was measured and analyzed. Contact resistance is influenced by technology of deposition of layers, by conditions ofcuring, by materials and surface quality of substrate etc. Three point methods is used for measuring of contact resistance. This parameter was analyzed in dependence on geometry of contact area. Polymer thick film pastes were used for preparation of samples.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2008
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
31st International Spring Seminar on Electronics Technology
ISBN
978-1-4244-3973-7
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
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Publisher name
IEEE
Place of publication
New York
Event location
Budapest
Event date
May 7, 2008
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000272337900102