The Quality of Contact of Conductive and Resistive Thick Film Layers

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00183833" target="_blank" >RIV/68407700:21230/11:00183833 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
The Quality of Contact of Conductive and Resistive Thick Film Layers
Original language description
The presented work is concerned with problems of contact of thick film layers. The samples with structures of two different layers were prepared. Conductive and resistive path were deposited by polymer thick film pastes by Screen-print technology. Silverpaste was used for conductive layers and carbon black paste for resistive layers. The contact resistance in interface of two layers represents parameter for quality evaluation. The three-wire method was used for measurement of contact of conductive andresistive layers. The influence of combination of different materials of conductive and resistive layers on contact quality was investigated.
Czech name
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Czech description
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Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Electronic Devices and Systems, IMAPS CS International Conference 2011 Proceedings
ISBN
978-80-214-4303-7
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
68-72
Publisher name
VUT v Brně, FEKT
Place of publication
Brno
Event location
Brno
Event date
Jun 22, 2011
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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