Lead Free Solder Material Compatibility and Technological Factors
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F09%3APU85166" target="_blank" >RIV/00216305:26220/09:PU85166 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Lead Free Solder Material Compatibility and Technological Factors
Original language description
Implementation of lead free soldering process needs new experience based on plenty of investigation in the way of effect and interactions during soldering.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/GA102%2F09%2F1701" target="_blank" >GA102/09/1701: Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
EDS '09 Proceedings
ISBN
978-80-214-3933-7
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
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Publisher name
NOVPRESS
Place of publication
Brno
Event location
Brno
Event date
Sep 2, 2009
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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