CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F10%3APU87238" target="_blank" >RIV/00216305:26220/10:PU87238 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES
Original language description
This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/GA102%2F09%2F1701" target="_blank" >GA102/09/1701: Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Second Forum of Young Researchers. In the framework of International Forum "Education Quality - 2010" : Proceedings
ISBN
978-5-7526-0442-3
ISSN
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e-ISSN
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Number of pages
444
Pages from-to
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Publisher name
Publishing House of ISTU
Place of publication
Izhevsk, Russia
Event location
Izhevsk
Event date
Apr 21, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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