Contribution to realization of 3D structures

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F10%3APU88083" target="_blank" >RIV/00216305:26220/10:PU88083 - isvavai.cz</a>

Result on the web

—

DOI - Digital Object Identifier

—

Result language

angličtina

Original language name

Contribution to realization of 3D structures

Original language description

This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized intwo ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).

Czech name

—

Czech description

—

Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

—

Project

<a href="/en/project/GA102%2F09%2F1701" target="_blank" >GA102/09/1701: Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability</a><br>

Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach

Publication year

2010

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

33rd International Spring Seminar on Electronics Technology (ISSE), 2010

ISBN

978-1-4244-7849-1

ISSN

—

e-ISSN

—

Number of pages

3

Pages from-to

—

Publisher name

IEEE Xplore digital library

Place of publication

Warsaw, Poland

Event location

Warsaw

Event date

May 12, 2010

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

—