Bonding of LTCC with Alumina ceramics

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F14%3APU109465" target="_blank" >RIV/00216305:26220/14:PU109465 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Bonding of LTCC with Alumina ceramics
Original language description
Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the Heraeus zero-shrink LTCC substrates is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for employing in heating elements or packaging. This paper is focused on description of reliable bonding technique of zero-shrink LTCC and alumina ceramics. Testing structure contains Thick Film pattern for verifying compatibility of the bonding process. For bonding of the substrates were used two methods: Cold Chemical Lamination (CCL) and Thermo-compression method employing dielectric thick film paste as adhesive. Optical method and electric testing of the screen-printed patterns ver
Czech name
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Czech description
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Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Electronic Devices and Systems, IMAPS CS International Conference 2014
ISBN
978-80-214-4985-5
ISSN
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e-ISSN
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Number of pages
149
Pages from-to
60-64
Publisher name
Vysoké učení technické v Brně
Place of publication
Brno
Event location
Brno
Event date
Jun 25, 2014
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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