Joining low temperature co-fired ceramics, Al2O3 and SiC substrates for higher operating temperature application
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22310%2F17%3A43914873" target="_blank" >RIV/60461373:22310/17:43914873 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.4028/www.scientific.net/SSP.258.631" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/SSP.258.631</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.4028/www.scientific.net/SSP.258.631" target="_blank" >10.4028/www.scientific.net/SSP.258.631</a>
Alternative languages
Result language
angličtina
Original language name
Joining low temperature co-fired ceramics, Al2O3 and SiC substrates for higher operating temperature application
Original language description
The article deals with forming solid joints of Low Temperature Co-fired Ceramic with Alumina or Silicon Carbide chips. The aim of this study is to find material of standard thick film layer process, which would be useful for electronic chip packages designed for higher operating temperatures (from 150 up to 800 °C). Heraeus Hera Lock 2000 Low Temperature Co-fired Ceramics (LTCC) was chosen, because of its nearly zero shrinkage during firing. Also other LTCC types were used to comparison of results. Conductive and isolating thick film pastes are used for joining. Temperature cycling of samples was applied. Strength of cycled samples was investigated by mechanical shear tests. The structure of microsection of joints was analyzed using optical and scanning electron microscope. The results show that thick film pastes are usable for joining above mentioned materials in specific temperature range.
Czech name
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Czech description
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Classification
Type
J<sub>SC</sub> - Article in a specialist periodical, which is included in the SCOPUS database
CEP classification
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OECD FORD branch
20501 - Materials engineering
Result continuities
Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Solid State Phenomena
ISSN
1662-9779
e-ISSN
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Volume of the periodical
258
Issue of the periodical within the volume
2017
Country of publishing house
CH - SWITZERLAND
Number of pages
4
Pages from-to
631-634
UT code for WoS article
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EID of the result in the Scopus database
2-s2.0-85009727187