Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F13%3APU105873" target="_blank" >RIV/00216305:26220/13:PU105873 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2013.6648228" target="_blank" >http://dx.doi.org/10.1109/ISSE.2013.6648228</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2013.6648228" target="_blank" >10.1109/ISSE.2013.6648228</a>
Alternative languages
Result language
angličtina
Original language name
Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate
Original language description
The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and astructure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics
ISSN
2161-2528
e-ISSN
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Volume of the periodical
36
Issue of the periodical within the volume
2013
Country of publishing house
SK - SLOVAKIA
Number of pages
5
Pages from-to
127-131
UT code for WoS article
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EID of the result in the Scopus database
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