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Bonding of zero-shrink LTCC with alumina ceramics

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3APU114802" target="_blank" >RIV/00216305:26220/15:PU114802 - isvavai.cz</a>

  • Result on the web

    <a href="http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-10-2014-0021" target="_blank" >http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-10-2014-0021</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1108/SSMT-10-2014-0021" target="_blank" >10.1108/SSMT-10-2014-0021</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Bonding of zero-shrink LTCC with alumina ceramics

  • Original language description

    Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates it is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging. This paper is focused on a description of reliable bonding technique of zero-shrink LTCC and alumina ceramics.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2015

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    SOLDERING & SURFACE MOUNT TECHNOLOGY

  • ISSN

    0954-0911

  • e-ISSN

    1758-6836

  • Volume of the periodical

    27

  • Issue of the periodical within the volume

    4

  • Country of publishing house

    GB - UNITED KINGDOM

  • Number of pages

    7

  • Pages from-to

    157-163

  • UT code for WoS article

    000360583700004

  • EID of the result in the Scopus database

    2-s2.0-84940372614