Impact of solder paste drying on the solderability

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F14%3APU110595" target="_blank" >RIV/00216305:26220/14:PU110595 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2014.6887592" target="_blank" >http://dx.doi.org/10.1109/ISSE.2014.6887592</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2014.6887592" target="_blank" >10.1109/ISSE.2014.6887592</a>

Result language
čeština
Original language name
Impact of solder paste drying on the solderability
Original language description
This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.
Czech name
Impact of solder paste drying on the solderability
Czech description
This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.

Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
37th Int. Spring Seminar on Electronics Technology
ISBN
978-1-4799-4455-2
ISSN
—
e-ISSN
—
Number of pages
495
Pages from-to
198-201
Publisher name
IEEE
Place of publication
Dresden
Event location
Dresden
Event date
May 7, 2014
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000346580500040

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