Measurements of solder paste viscosity during its tempering and aging
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00221828" target="_blank" >RIV/68407700:21230/14:00221828 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887590&isnumber=6887550" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887590&isnumber=6887550</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2014.6887590" target="_blank" >10.1109/ISSE.2014.6887590</a>
Alternative languages
Result language
angličtina
Original language name
Measurements of solder paste viscosity during its tempering and aging
Original language description
Solder paste printing is one of the most important steps in the surface mount technology, which has high influence on the resulting quality of solder joints. To achieve a good joint quality, the solder paste should have specific properties like adhesion,viscosity, size of the solder alloy particles, amount of flux etc. This paper is focused on the measurement of the solder paste viscosity during its tempering and aging with possibility of regeneration of solder paste properties by jelly flux. Three types of solder pastes were used in the experiment: Sn95.5Ag4Cu0.5, Sn96.5Ag3Cu0.5 and Sn62Pb36Ag2. Viscosity of solder paste is measured from storing temperature to the ambient temperature. Aging of solder pastes is made in ambient atmosphere. Regenerationof solder paste properties after aging was done by adding of jelly flux Amtech 4300/LF-4300-TF. The viscosity of pure solder paste before aging, pure solder paste after aging and solder paste after aging regenerated by jelly flux was mea
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
37th Int. Spring Seminar on Electronics Technology
ISBN
978-1-4799-4455-2
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
189-192
Publisher name
IEEE
Place of publication
New York
Event location
Drážďany
Event date
May 7, 2014
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000346580500038