DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3APU113938" target="_blank" >RIV/00216305:26220/15:PU113938 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY
Original language description
The paper deals with the detection of defects using X-ray technology. It is focused on a particular type of X-ray machine, which is used for most of these experiments. X-ray cabinet is commonly used for analyzes of defects, which are formed during soldering process. Paper also includes an introduction of different types of defects. These defects are serious issue and they can cause malfunction of infected components or of the entire device. That is the main reason it is so important to focus on this issue.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 21st Conference STUDENT EEICT 2015
ISBN
978-80-214-5148-3
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
391-395
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních
Place of publication
Brno
Event location
Brno
Event date
Apr 23, 2015
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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