ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU121510" target="_blank" >RIV/00216305:26220/16:PU121510 - isvavai.cz</a>
Result on the web
<a href="http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf" target="_blank" >http://www.feec.vutbr.cz/EEICT/2016/sbornik/EEICT-2016-sborn%C3%ADk-komplet.pdf</a>
DOI - Digital Object Identifier
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Result language
čeština
Original language name
ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS
Original language description
This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection.
Czech name
ANALYSIS OF DEFECTS ON PCB USING X-RAY, 3D SW CERA AND MICRO-SECTIONS
Czech description
This paper deals with detecting of defects on BGA (Ball Grid Array) components using X-ray. Defects are formed throw reflow process of BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection.

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the 22nd Conference STUDENT EEICT 2016
ISBN
978-80-214-5350-0
ISSN
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e-ISSN
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Number of pages
789
Pages from-to
206-208
Publisher name
Neuveden
Place of publication
Neuveden
Event location
Brno
Event date
Apr 28, 2016
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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