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ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU118994" target="_blank" >RIV/00216305:26220/16:PU118994 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

  • Original language description

    This paper deals with optimizing of copper plating process for manufacturing of small-scale industries of printed circuit boards. Main discussed procedure in this paper is activation of printed circuit board surface for conformal copper plated surface of through holes. Innova-tive part of process was activating of holes surface with utilization of vacuum (lower pres-sure) and ultrasound. It helps reduce unplated edge of hole.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2016

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Proceedings of the 22nd Conference STUDENT EEICT 2016

  • ISBN

    978-80-214-5350-0

  • ISSN

  • e-ISSN

  • Number of pages

    777

  • Pages from-to

    610-614

  • Publisher name

    Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

  • Place of publication

    Brno

  • Event location

    Brno

  • Event date

    Apr 28, 2016

  • Type of event by nationality

    CST - Celostátní akce

  • UT code for WoS article