ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU118994" target="_blank" >RIV/00216305:26220/16:PU118994 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING
Original language description
This paper deals with optimizing of copper plating process for manufacturing of small-scale industries of printed circuit boards. Main discussed procedure in this paper is activation of printed circuit board surface for conformal copper plated surface of through holes. Innova-tive part of process was activating of holes surface with utilization of vacuum (lower pres-sure) and ultrasound. It helps reduce unplated edge of hole.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
—
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 22nd Conference STUDENT EEICT 2016
ISBN
978-80-214-5350-0
ISSN
—
e-ISSN
—
Number of pages
777
Pages from-to
610-614
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Place of publication
Brno
Event location
Brno
Event date
Apr 28, 2016
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
—