Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F21%3APU140710" target="_blank" >RIV/00216305:26220/21:PU140710 - isvavai.cz</a>
Result on the web
<a href="https://www.mdpi.com/1996-1944/14/9/2218/htm" target="_blank" >https://www.mdpi.com/1996-1944/14/9/2218/htm</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.3390/ma14092218" target="_blank" >10.3390/ma14092218</a>

Result language
angličtina
Original language name
Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components
Original language description
The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.
Czech name
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Czech description
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Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
—
OECD FORD branch
20501 - Materials engineering

Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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