Behaviour of printed resistors compatible with thick film copper technology
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43966055" target="_blank" >RIV/49777513:23220/22:43966055 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9939548" target="_blank" >https://ieeexplore.ieee.org/document/9939548</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ESTC55720.2022.9939548" target="_blank" >10.1109/ESTC55720.2022.9939548</a>
Alternative languages
Result language
angličtina
Original language name
Behaviour of printed resistors compatible with thick film copper technology
Original language description
This paper is focused on printed resistors compatible with Thick Printed Copper (TPC). TPC technology is new prospective technology for the realization of power electronic substrates and can be used as an alternative to conventional Direct Bonded Copper or Active Metal Brazing technologies. TPC technology has many benefits and also enables the direct integration of printed resistors on a power substrate. Three variants of printed resistors based on different resistive materials (standard resistive thick film paste, copper-nickel nanoparticle ink and copper-nickel thick film paste) were verified and tested. The properties of these resistors are described in this paper.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC 2022) : proceedings
ISBN
978-1-66548-947-8
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
228-232
Publisher name
IEEE
Place of publication
Piscataway
Event location
Sibiu, Romania
Event date
Sep 13, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001108538800042