Study of new nitrogen-fireable copper-nickel thick film paste formulation compatible with thick printed copper

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43964064" target="_blank" >RIV/49777513:23220/22:43964064 - isvavai.cz</a>

Alternative codes found

RIV/00216275:25310/22:39920123

Result on the web

<a href="https://www.mdpi.com/1996-1944/15/4/1372" target="_blank" >https://www.mdpi.com/1996-1944/15/4/1372</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma15041372" target="_blank" >10.3390/ma15041372</a>

Result language

angličtina

Original language name

Study of new nitrogen-fireable copper-nickel thick film paste formulation compatible with thick printed copper

Original language description

This paper is focused on a new copper-nickel thick film resistive paste which was designed and experimentally developed for the realization of low-ohmic power resistors. This copper-nickel paste has been designed for use in combination with thick printed copper conductors and in comparison with conventional ruthenium-based thick film resistor pastes allows firing in a nitrogen protective atmosphere. The copper-nickel paste was prepared from copper and nickel microparticles, glass binder particles and a combination of organic solvents optimized for its firing in a nitrogen atmosphere. This paper covers a detailed description of copper-nickel paste composition and its thermal properties verified by simultaneous thermal analysis, a description of the morphology of dried and fired copper-nickel films, as well as the electrical parameters of the final printed resistors. It has been proven by electron microscopy with element distribution analysis that copper and nickel microparticles diffused together during firing and created homogenous copper-nickel alloy film. This film shows a low temperature coefficient of resistance 45 x 0-6 K-1 and low sheet resistance value 45 mW/square. It was verified that formulated copper-nickel paste is nitrogen-fireable and well-compatible with thick printed copper pastes. This combination allows the realization of power substrates with directly integrated low-ohmic resistors.

Czech name

—

Czech description

—

Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2022

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Materials

ISSN

1996-1944

e-ISSN

1996-1944

Volume of the periodical

15

Issue of the periodical within the volume

4

Country of publishing house

CH - SWITZERLAND

Number of pages

10

Pages from-to

1-10

UT code for WoS article

000765090900001

EID of the result in the Scopus database

2-s2.0-85124688925