Reliability of printed power resistor with thick-film copper terminals
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955541" target="_blank" >RIV/49777513:23220/19:43955541 - isvavai.cz</a>
Result on the web
<a href="https://www.sciencedirect.com/science/article/pii/S0167931719302515" target="_blank" >https://www.sciencedirect.com/science/article/pii/S0167931719302515</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.mee.2019.111095" target="_blank" >10.1016/j.mee.2019.111095</a>
Alternative languages
Result language
angličtina
Original language name
Reliability of printed power resistor with thick-film copper terminals
Original language description
This paper is focused on the thick-film power resistors with copper terminals. These terminals are created by the new Thick Printed Copper (TPC) technology. This technology is based on sequential screen printing and firing of copper paste in nitrogen atmosphere on an alumina substrate. Thick-film power resistor with copper terminals represents a potential replacement of standard wirewound power resistors and allows the direct integration of resistors on TPC substrates. Printed resistors on TPC substrates can be supplemented with discrete electronic components which creates the possibility to realize really complex power electronic circuits. The direct integration of printed components is not possible in case of using the standard Direct Bonded Copper (DBC) technology. The main benefits of printed resistors based on TPC technology are their low thickness and good thermal conductivity. The low thickness of resistors is important for miniaturization of final electronic devices. The resistor main electrical parameters as the temperature coefficient of resistance, temperature coefficient and nominal resistance value after dry heat aging and after thermal cycling, insulation resistance, dielectric strength etc., are described in this paper.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Microelectronic Engineering
ISSN
0167-9317
e-ISSN
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Volume of the periodical
216
Issue of the periodical within the volume
August 2019
Country of publishing house
NL - THE KINGDOM OF THE NETHERLANDS
Number of pages
8
Pages from-to
1-8
UT code for WoS article
000487764900020
EID of the result in the Scopus database
2-s2.0-85069660775