Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43963517" target="_blank" >RIV/49777513:23220/21:43963517 - isvavai.cz</a>

Result on the web

<a href="https://www.mdpi.com/1996-1944/14/22/7039" target="_blank" >https://www.mdpi.com/1996-1944/14/22/7039</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma14227039" target="_blank" >10.3390/ma14227039</a>

Result language

angličtina

Original language name

Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications

Original language description

This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet technology. The first type of ink was based on copper and nickel nanoparticles with a ratio of 75:25, and the second type of ink consisted of copper–nickel alloy nanoparticles with a ratio of 55:45. The characterization of electrical parameters, microstructure, thermal analysis of prepared inks and study of the influence of copper–nickel content on electrical parameters are described in this paper. It was verified that ink with a copper–nickel ratio of 55:45 (based on constantan nanoparticles) is more appropriate for the production of resistors due to low sheet resistance ~1 W/square and low temperature coefficient of resistance 10010????6 K????1 values. Copper–nickel inks can be fired in a protective nitrogen atmosphere, which ensures compatibility with copper films. The compatibility of copper–nickel and copper films enables the production of integrated resistors directly on ceramics substrates of power electronics modules made by TPC technology.

Czech name

—

Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2021

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Materials

ISSN

1996-1944

e-ISSN

—

Volume of the periodical

14

Issue of the periodical within the volume

22

Country of publishing house

CH - SWITZERLAND

Number of pages

7

Pages from-to

1-7

UT code for WoS article

000724889300001

EID of the result in the Scopus database

2-s2.0-85119903968